Layer |
0-20 L |
PCB Max. outside size |
1100 x500 mm |
Board Materials |
FR-4; Aluminum Base; High Frequency; PFTE; FPC; Thick Copper; BT Base; Pi Base; Tg130℃/ Tg170℃, Rogers, Berquist, Thermagon, (Taconic),Flexi Rigids |
Board Min thickness |
0.2mm (2 layers) / 0.5mm (4 layers) /0.8mm (6 layers)/ 1.0mm(8 layers) / 1.2mm (10 layers) / 1.3mm (12 layers) / 1.5mm (14 layers) / 1.7mm (16 layers) / 1.8mm / 2.0 mm (18 layers) / 2.2mm (20 layers) |
Board Max thickness |
315mil(6.0mm) |
Max copper thickness |
6oz |
Inner layer Min line width/space |
3mil(0.075mm) / 3mil(0.075mm) |
Outer layer Min line width/space |
3mil(0.075mm) / 3mil(0.075mm) |
Min finished drilling size |
6mil(0.15mm) |
Max aspect ratio |
12:01:00 |
Min PTH via & pad size |
via: dia. 0.2mm / pad: dia. 0.4mm ; HDI ≤0.10mm via |
Min hole tolerance |
±0.05mm(NPTH), ±0.076mm(PTH) |
Finished hole tolerance(PTH) |
±3mil(0.075mm) |
Finished hole tolerance(NPTH) |
±2mil(0.05mm) |
PTH hole copper thickness |
20um(1.0mil) |
Accuracy from hole to hole |
±2mil(0.05mm) |
Outline line tolerance |
±4mil(0.1mm) |
Solder mask thickness |
0.254mil(0.001mm) |
Isolation Resistance |
1 × 1012Ω |
Hot impact |
3 × 10Sec@288 ℃ |
Wrap/ twist |
≤0.75% |
Peel off |
1.4N / mm |
Solder mask abrasion |
≥6H |
Block burning level |
94V – O |
Impedance control |
±10% |
Min solder mask opening |
0.05mm(2mil) |
Min solder mask cover |
0.05mm(2mil) |
Min solder mask brige |
0.1mm(4mil) |
Surface treatment |
flash gold; immersion gold/immersion silver; OSP; HAL/HAL lead free; halogen free; carbon; gold finger(30u”); immersion silver (3~10u”); immersion tin(0.6~1.2um); peelable mask |
Gold finger thickness |
0.76um max ( 30u” max ) |
V-cut angle |
0.76um max ( 30u” max ) |
Min V-cut thickness |
0.8mm |
V-cut saving size tolerance |
0.8mm |
Outline |
Routing & Punching |
Testing accuracy |
±0.1mm(4mil) |
E-TEST voltage |
250 ± 5 V |